固溶温度对Cu-Ni-Si-Co合金组织及性能的影响

    Effects of Solid Solution Temperature on Microstructure and Properties of Cu-Ni-Si-Co Alloy

    • 摘要: 通过真空熔炼制备φ100 mm的Cu-Ni-Si-Co合金铸锭,采用不同温度对合金进行固溶处理,使用布氏硬度计、涡流导电仪器、金相显微镜、扫描电子显微镜对合金的微观组织和性能进行分析。结果表明:铸态Cu-2.25Ni-0.6Si-0.3Co合金第二相为Ni2Si化合物,尺寸为1~2μm,并且长径比相对较小,提高Ni、Si、Co的含量使得合金第二相的尺寸和长径比都有所增加,形成为(Ni,Co)2Si化合物,尺寸为3~5μm;随固溶温度的升高,合金硬度呈现先下降后上升再下降的趋势,导电率则先大幅度下降后趋于平缓,合金经950℃保温1 h水淬后的固溶效果较好,两种合金试样的硬度和导电率分别为90.13 HB、20.79%IACS和121.67 HB、17.74%IACS,晶粒尺寸分别为(3.0±1.05)mm和(3.22±1.42) mm。

       

      Abstract: Cu-Ni-Si-Co alloy ingot of φ100 mm was prepared by vacuum melting, and the alloy was solution-treated at different temperatures. The properties and microstructure of the alloy were analyzed by Brinell hardness tester, eddy current conductivity instrument, metallographic microscope and scanning electron microscope. The results show that the second phase of the as-cast Cu-2.25Ni-0.6Si-0.3Co alloy is a Ni2Si compound with a size of 1-2 μm and a relatively small aspect ratio,increasing the contents of Ni, Si and Co, the size and aspect ratio of the second phase of the alloy are increased, and it is formed into a(Ni, Co)2Si compound with a size of 3-5 μm. With the increase of the solution temperature, the hardness of the alloy first decreases, then increases and decreases, the conductivity first decreases sharply and then levels off. The solid solution effect of the alloy after 950 ℃ insulation for 1h is better. The hardness and conductivity of the two alloy samples are 90.13 HB, 20.79%IACS and 121.67 HB, 17.74%IACS, respectively, the grain sizes are(3.0±1.05) mm and(3.22±1.42) mm, respectively.

       

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