Abstract: The dispersed carbon nanotubes were attached to the surface of copper foil by diffusion bonding method.After cutting, stacking and pre-pressing, CNTs/Cu layered composite with excellent conductivity were prepared by sintering in vacuum hot pressing sintering furnace.The microscopic characterization of CNTs/Cu layered composite was carried out by SEM, EDS and XRD.Sample performance was tested using a microhardness meter and a conductivity detector, etc.The results show that during hot pressing sintering, a certain amount of copper diffuses into CNTs layer, which effectively improves the bonding ability between CNTs layer and copper layer.Compared with pure copper, CNTs/Cu layered composite not only improve the hardness by 45%, but also achieve 91%IACS in the direction parallel to the carbon nanotube layer and 80.6% IACS in the direction perpendicular to the carbon nanotube layer.