基于BGA填充胶封装焊点可靠性研究
Research on Reliability of Underfill BGA Package lead-free Solder Joint
李朝林
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作者单位：江苏淮安信息职业技术学院
中文关键字：BGA 底部填充胶 跌落实验 热循环实验 可靠性
英文关键字：BGA Underfill Drop Test Thermal cycle Reliability
中文摘要：通过基板级跌落实验、热循环测试实验以及焊点一维热应力计算等方法研究，结果表明底部填充胶封装BGA焊点可增强基板的抗跌落性能、耐热循环性能，提高基板的可靠性。添加填充剂的底部填充胶BGA封装焊点比未添加填充剂的底部填充胶BGA封装焊点的抗跌落能力要强。选用添加填充剂的底部填充胶且热膨胀系数低的材料，可以显著减少BGA封装焊点的内热应力，焊点有较佳的耐热循环能力。
英文摘要：The results show that underfill BGA solder joints can strengthen substrate performance of resistance droping, it can also inprove the reliability of the substrate, Based on such study of substrate level drop experiment, solder joints thermal cycling test and one-dimensional thermal stress calculation. Those with underfill had a stronger ability of resistance droping than that of without underfill. The thermal stress of BGA solder joints can reduce obviously by using material with underfill and lower thermal expansion factor, and solder joints had better ability of resistance heat cycling.