Bi对Sn-3.0Ag-0.5Cu无铅焊料微观组织和性能的影响
Effects of Bi on microstructures and property of Sn-3.0Ag-0.5Cu solder
张彦娜
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作者单位：南京信息职业技术学院
中文关键字：Sn-3.0Ag-0.5Cu；熔化温度；润湿性；微观组织
英文关键字：Sn-3.0Ag-0.5Cu；melt tempreture；wetting property；microstructures
中文摘要：本文在Sn-3.0Ag-0.5Cu焊料的基础上，掺加不同比例的Bi元素，形成Sn-Ag-Cu-Bi系合金，研究不同掺量的Bi对Sn-3.0Ag-0.5Cu的熔化温度、润湿性及焊接接头的微观组织等性能的影响。研究结果表明，添加Bi能够明显降低焊料的熔点，但当Bi含量超过5%时，熔程增大；添加3%以内的Bi能明显提高其润湿性。
英文摘要：Sn-Ag-Cu-Bi alloy is formed by adding Bi element in the Sn-3.0Ag-0.5Cu solder in this paper. The Sn-3.0Ag-0.5Cu solder alloy is investigated by the different additon of Bi element.The investigation inclus melt tempreture, wetting property and microstructures of welding joint.The results show that: The melting is depressed when Bi content is added.But when Bi content is above 5%,melting range is increased; The wettabilities is visibly increased when Bi content is below 3%.