无铅焊料Sn-3Ag-xSb系微观组织及焊接性研究
Microstructure and Weldability of New Lead-free Solder Sn-3Ag-xSb
吴建波, 赵振兴, 吕 雪, 张 飞
点击:3527次 下载:0次
作者单位:(合肥工业大学 材料科学与工程学院, 安徽 合肥 230009)
中文关键字:无铅焊料; 润湿性能; Sn-3Ag-xSb
英文关键字:lead-free solder; solderability; Sn-3Ag-xSb
中文摘要:采用定量的方法,研究Sn-3Ag-xSb(x取2,5,7)系新型无铅焊料的微观组织、润湿性以及焊接接头的性能,进而探究无铅焊料成分中Sb质量百分比的差异对焊料相关性能的影响。结果表明:在一定范围内随着Sb质量分数的增加,Sn-3Ag-xSb系无铅焊料组织晶粒得到细化,并且润湿性和焊接性能都得到了一定的提高。
英文摘要:The microstructure,wettability and solder joint performance of new lead-free solder Sn-3Ag-xSb (x take 2,5,7) were studied by quantitative method,then the effects of Sb content on the solderability of the lead-free solder were investigsted. The results show that with the increase of Sb, the microstructure of Sn-3Ag-xSb lead-free solder is refined within a certain range. The solder wettability and performance can be improved to some extent.