弧离子镀TiAlN涂层与模具钢基材的结合力的优化
Optimization of Adhesion Strength Between Arc Ion Plating TiAlN Films and Die Steel Substrate
孙国栋, 刘长华
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作者单位：(九江学院 机械与材料工程学院, 江西 九江 332005)
中文关键字：弧离子镀； TiAlN； 结合力； 正交方法
英文关键字：arc ion plating; TiAlN; adhesion strength; orthogonal method
中文摘要：采用弧离子镀方法在SKD61模具钢基体上制备TiAlN薄膜，分析了工艺参数对膜层与模具钢基体结合力的影响。 应用正交法， 依据涂层与基体的临界载荷越大结合力越好的原则，得出了最优涂层的工艺参数：基体温度220 ℃、弧流60 A、沉积基体偏压-800 V、气体压强1.3 Pa、预处理基体偏压-450 V和预处理时间15 min。优化后的涂层与基体的临界载荷达到56 N，比优化前最大临界载荷增加43%。TiAlN薄膜与模具钢基体结合力的改进主要归功于涂层的高硬度和TiAlN相(111)、(200)和(220)取向的竞争生长。
英文摘要：he TiAlN film was prepared on SKD61 die steel substrate by arc ion plating (AIP) deposition. The effects of process parameters on adhesion strength between the film and the substrate were investigated. The optimized film process parameters(substrate temperature 220 ℃, arc power 60 A, bias voltage -800 V, nitrogen pressure 1.3 Pa, pretreated voltage -450 V and pretreated time 15 min) were obtained from the results of 18 AIP processes designed by orthogonal program according to the principle that the larger the critical load, the better the srength. The results show that the critical load of TiAlN film is up to 56 N, increased by 43% compared with the highest critical load before optimization. The improvement on the adhesion strength of film is attributed to the high hardness and the emulative growth of TiAlN phase in(111), (200) and (220) orientations.