真空电子器件常用金属焊接用钎焊料
Brazing Material Used for Common Metal Materials in Vacuum Electron Devices
李银娥， 姜 婷， 孙晓亮， 马 光
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作者单位：（西北有色金属研究院，陕西 西安 710016）
中文关键字：钎焊； 钎焊料； 真空电子器件
英文关键字：brazing; brazing material; vacuum electronic devices
中文摘要：真空电子器件是由多种材料（包括金属材料和非金属材料）通过焊接方法连接成为结构复杂的构件，尺寸精度要求高，所用钎焊料种类也较多，常用的钎焊料有银基、金基、铜基、钯基和一些活性钎料等。本文就其常用钎焊料进行了简要介绍。
英文摘要：Vacuum electronic device is a kind of complex structure component with varieties of materials, including metal and non-metal, connected by welding. The requirement of dimensional accuracy is high and the kinds of brazing material are diverse, and the common brazing material is Ag-based, Au-based, Cu-based, Pd-based, some active brazing metal and so on. The common brazing material was briefly introduced.