新型无铅焊料Sn-X-Cu-Ni的物理性能研究
Physical Properties of New Type Lead-free Solder Sn-X-Cu-Ni
杨 磊1 ， 揭晓华1， 郭 黎2
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作者单位：1.广东工业大学 材料与能源学院，广东 广州 510006；2.高新锡业（惠州）有限公司，广东 惠州 516123
中文关键字：无铅焊料； 电阻率； 导热系数； 熔锡速度
英文关键字： lead-free solder; resistivity; thermal conductivity; tin melting rate
中文摘要：利用化学元素周期表上第 ⅤA族X元素和Ni元素代替Sn-Ag-Cu系列中的Ag制备出一种新型无铅焊料。研究了X含量对新型无铅焊料的导电性、导热性、熔锡速度和干燥度等物理性能的影响。结果表明：Sn-X-Cu-Ni系合金焊接前后导电性随着X含量的增加而增加，当X含量增到4.5%时，导电性最好，随后又开始下降；新型焊料的导热性与导电性有相似的变化规律。
英文摘要：Using X element ( ⅤA group in periodic table) and Ni taking the place of Ag in Sn-Ag-Cu series, a new type of lead-free solder was prepared. The effects of X content on the conductivity, thermal conductivity, tin melting rate, dryness, and other physical properties of the new lead-free solder were studied. The results show that either before or after welding, the electrical conductivity of Sn-X-Cu-Ni alloy increases with increasing X content. When the content of X increases to 4.5%, the conductivity is best and then declines. The new solder thermal conductivity and electrical conductivity have a similar variation rule.