稀土对SnAgCu系钎料合金蠕变断裂寿命的影响
Effect of RE on Creep Rupture Life of SnAgCu Solder
杨 洁
点击：3398次 下载：0次
作者单位：南京信息职业技术学院 机电学院，江苏 南京 210046
中文关键字：稀土； SnAgCu； 蠕变寿命； 无铅钎料
英文关键字：RE; SnAgCu; creep life; lead-free solder
中文摘要：基于ANSYS软件，采用有限元方法，对不同稀土含量的SnAgCuRE系钎料钎焊接头的蠕变断裂寿命进行预测，并进行了相关的试验验证。结果表明，添加微量RE可提高SnAgCu钎料的抗蠕变性能。当稀土含量为0.1wt%时，接头蠕变断裂寿命最高，可以达到未添加稀土时的5～6倍。当稀土含量超过0.1wt%时，接头的蠕变断裂寿命呈下降趋势。这与试验测量结果呈现出较好的一致性。这一结果对于新型无铅钎料的研制具有一定的指导意义。
英文摘要：The creep rupture life of SnAgCuRE solder with different content of rare-earth was predicted using non-linear finite element method with ANSYS software, and the relevant experiment was carried out. The results indicate that the addition of trace RE can improve the resistance of SnAgCu solder creep. The highest creep rupture life can be achieved with 0.1%RE content, which can be up to 5～6 times longer than that without adding rare earth. The results of simulation accord with the experiments. The results are importance to develop lead-free solder.