Al2O3弥散强化铜与T2铜的真空钎焊工艺研究
Study on Vacuum Brazing of Al2O3 Dispersion-strengthen Copper and Copper T2
朱音，王海龙
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作者单位：江苏科技大学
中文关键字：Al2O3弥散强化铜；T2铜；真空钎焊；抗拉强度；显微组织
英文关键字：Al2O3 dispersion-strengthen copper; copper T2; vacuum brazing; tensile strength; microstructure
中文摘要：本文用Ag-Cu-Ti钎料以及Ag-Cu-Ti+BAg72Cu复合钎料对Al2O3弥散强化铜与T2铜进行真空钎焊，研究了钎焊温度和保温时间对钎焊接头组织和性能的影响。结果表明，温度过低或保温时间过短，钎料与母材相互冶金作用较弱，接头性能较差；温度过高或保温时间过长，钎料向弥散强化铜中毛细渗入严重，焊缝中出现孔洞，接头强度也下降。利用Ag-Cu-Ti+BAg72Cu复合钎料进行钎焊能有效提高接头强度。
英文摘要：The article is about vacuum brazing of Al2O3 dispersion-strengthen copper to copper T2 with the filler Ag-Cu-Ti and BAg72Cu. The influence of brazing temperature and holding time on microstructure and tensile strength is studied. The results show that when the temperature is lower, metallurgical action is not good and the bond is not firm. When the temperature is higher or the holding time is longer, the filler seriously infiltrates into Al2O3 dispersion-strengthen copper, causing the appearance of holes in brazed joint, which affects the quality of joint. Brazing with Ag-Cu-Ti and BAg72Cu composite filler, the performance of joint is much better.