低银无铅焊料的应用——SAC105+Mn焊点可靠性验证试验
Application of Low-Ag Lead-free Solder—— Solder Joint Reliability Verification Test of SAC105+Mn
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作者单位：健雄职业技术学院 电气工程学院
中文关键字：低Ag无铅焊料；SAC105+Mn；SAC305；焊点；可靠性
英文关键字：low-Ag lead-free solder; SAC105+Mn；SAC305；solder joint; reliability
中文摘要：随着近年银价的持续上涨，低银无铅焊料成为市场关注的焦点。本文从实际应用的角度分析了低银焊料中含银量对焊料熔点、浸润性、焊点可靠性三个重要焊接特性的的影响和目前低银无铅焊料的研究方向。并通过小批量生产，验证了SAC105掺杂Mn后的焊点可靠性和SAC305相当。
英文摘要：The price of silver has been continuously on the rise over the past few years, which makes low-silver lead-free solder the focus of the market. This paper presents a practical perspective to analyze 1) the impacts of silver content in low-Ag solder on the three important welding properties, i.e. solder melting point, wettability, and solder joint reliability, and 2) the current research topics on low-Ag lead-free solder. This paper shows that in small batch production, the solder joint reliability of SAC105+Mn is comparable to that of SAC305.